By Joel Hruska
| Published: March 25, 2007 - 10:03PM CT
According to a new paper released at the IEEE Semi-Therm conference, IBM has discovered a way to dramatically improve processor cooling. Unlike some other recent cooling breakthroughs, IBM's discovery appears to be one that should be relatively inexpensive to implement, and could have a significant impact on consumer microprocessors in the near future. Without fundamentally changing the approach to CPU cooling today and without the use of more advanced setups like water coolers, IBM says that they can double CPU cooling capacity while making it easier and safer to do so.
A CPU's heatspreader is normally attached directly to the core by use
of a paste or glue that has been enriched with micrometer-sized ceramic
or metal particles. These particles then form heat-evacuation bridges
between the core and the cooler
clipped from arstechnica.com
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